Nordic chip-scale Bluetooth LE solution enables module to satisfy complex wireless applications

16
Feb
2017
Oslo, Norway
MtM Technology, module

MtM Technology Corporation’s M905 AoP module employs wafer-level chip scale package variant of Nordic’s nRF52832 SoC allowing manufacturers with limited RF experience to easily develop compact, sophisticated wireless products.

Nordic Semiconductor today announces that Taiwan-based MtM Technology Corporation has selected Nordic’s nRF52832 Bluetooth® Low Energy System-on-Chip (SoC) for its M905 Antenna-on-Package (AoP) module. The M905 is a fully integrated, ultra low power Bluetooth LE module designed to enable a wide range of sophisticated wirelessly-connected products with a ‘plug-and-play’ solution that can lower development costs and speed time-to-market.

The module employs the 3 by 3.2mm wafer-level chip scale package (WL-CSP) variant of Nordic’s nRF52832 SoC, which alongside MtM’s System-in-Package (SiP) technology results in a 6.5 by 6.5mm form factor and makes the module suitable for a wide range of space-constrained, low power applications, for example wearables or standalone devices offering voice control, pattern recognition, or environmental learning functionality.

The M905 allows product manufacturers to speed up development, production, and time-to-market of demanding Bluetooth 4.2-enabled applications, without the customer requiring any RF design expertise. The module includes an integrated antenna, along with a full range of programmable on-chip analog and digital peripherals.

Nordic’s nRF52832 Bluetooth LE SoC, a member of Nordic’s sixth generation of ultra low power (ULP) wireless connectivity solutions enables the module to power even the most complex, processor-intensive wireless applications.

Quote
Our experience both in terms of technical and business support is a key reason why we continue to work with Nordic.
Cedric Lam, MtM Technology Corporation
The SoC combines a 64MHz, 32-bit ARM® Cortex® M4F processor with a 2.4GHz multiprotocol radio (supporting Bluetooth 5, ANT™ and proprietary 2.4GHz RF software) featuring -96dB RX sensitivity, with 512kB Flash memory, 64kB RAM, and an NFC™-A tag for “Touch-to-Pair” operations. When launched, the SoC was the world’s highest performance single-chip Bluetooth LE solution, delivering up to 60 percent more generic processing power, offering 10 times the Floating Point performance, and twice the DSP performance compared to competing solutions. 

The nRF52832 SoC has been engineered to minimize power consumption with features such as the 2.4GHz radio’s 5.5mA peak RX/TX currents and a fully-automatic power management system that reduces power consumption by up to 80 percent compared with Nordic’s nRF51 Series SoCs. The result is a Bluetooth LE solution which offers 58 CoreMark/mA, up to twice as power efficient as competing devices.

“The nRF52832 SoC was a natural choice for us,” says Cedric Lam, MtM Technology Corporation, Chief Technology Officer. “The tiny WL-CSP is the smallest package on the market which includes such a powerful processor and rich I/O support. Moreover, power consumption—which is crucial to our customers—is among the lowest in the market. And the integrated NFC-A tag for easy pairing reinforced our decision.

“Our experience both in terms of technical and business support is a key reason why we continue to work with Nordic.” 

The M905 will also be available as a Development Kit board, allowing the module to be interfaced with MtM’s existing range of sensor boards.

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