Taiyo Yuden’s module employs the wafer level-chip scale package variant of Nordic's nRF52832 SoC to meet the needs of developers of complex, space-constrained wireless products
The SoC combines a 64MHz, 32-bit ARM® Cortex® M4F processor with a 2.4GHz multiprotocol radio (supporting Bluetooth 5, ANT™ and proprietary 2.4GHz RF software) featuring -96dB RX sensitivity, with 512kB Flash memory, 64kB RAM, and an NFC™-A tag for “Touch-to-Pair” operations. When launched, the SoC was the world’s highest performance single-chip Bluetooth LE solution, delivering up to 60 percent more generic processing power, offering 10 times the Floating Point performance, and twice the DSP performance compared to competing solutions.
The nRF52832 SoC has been engineered to minimize power consumption with features such as the 2.4GHz radio’s 5.5mA peak RX/TX currents and a fully-automatic power management system that reduces power consumption by up to 80 percent compared with Nordic’s nRF51 Series SoCs. The result is a Bluetooth LE solution which offers 58 CoreMark/mA, up to twice as power efficient as competing devices.
“Taiyo Yuden now has 11 modules employing either Nordic’s nRF51 or nRF52 SoCs, and the common software architecture has allowed us to easily switch between the two,” says Mikio Aoki, Taiyo Yuden Project Manager. “In this instance, we selected the nRF52832 WL-CSP for its powerful and universal ARM Cortex M4F processor and the large Flash and RAM capacity, as well as the NFC-A tag for Touch-to-Pair applications.
“As a company, Nordic provides great quality development and control support and very fast response.”
The EYSHSNZWZ Bluetooth LE module will be available in commercial quantities from May 2017.