Nordic-powered module enables Matter over Thread for smart home applications

HooRii Technology

HooRii Technology’s HRN71 module employs Nordic’s nRF52840 SoC for Thread and Bluetooth LE wireless connectivity

Nordic design partner HooRii Technology has launched a Matter, Lightweight Machine-to-Machine (LwM2M) and Open Connectivity Foundation (OCF) over Thread compatible module, designed for use in high-end, space-constrained smart home and lighting applications. The Thread 1.3.0 certified ‘HRN71’ module is available in two different versions, one with a PCB antenna measuring 10 by 12 by 2.6 mm, the other with support for an external antenna in a 10 by 10 by 2.6 mm form factor.

The module is powered by Nordic Semiconductor’s nRF52840 multiprotocol SoC. The SoC is a Thread certified component and is suitable for developing products for the Matter connected home ecosystem. 

Quote
The small size of the nRF52840 SoC was key to our design
Zax Huang, HooRii Technology

Support for Matter over Thread

The HooRii Technology module supports Matter over Thread, LwM2M over Thread, and OCF over Thread technologies. For Matter applications the module uses the nRF52840 SoC’s Thread connectivity for transport and Bluetooth® LE connectivity for commissioning new devices to a network. Matter over Thread prototyping is supported by Nordic’s nRF52840 DK single-board development kit for the nRF52840 SoC.

The module runs on the HooRiiOS operating system, which provides development-free Matter firmware and can support a wide variety of smart home products including locks, curtain motors, lighting and power sockets.

“The small size of the nRF52840 SoC was key to our design,” says Zax Huang, Branding Director at HooRii Technology. “We also selected this chip based on its reliable and stable performance, in conjunction with its ultra low power consumption.

“Nordic’s development tools were also very important. With industry-leading software maturity and stability, we benefited greatly from the excellent documentation and comprehensive technical information.”