MtM Technology Corporation’s M905 AoP module employs wafer-level chip scale package variant of Nordic’s nRF52832 SoC allowing manufacturers with limited RF experience to easily develop compact, sophisticated wireless products.
Nordic Semiconductor today announces that Taiwan-based MtM Technology Corporation has selected Nordic’s nRF52832 Bluetooth® Low Energy System-on-Chip (SoC) for its M905 Antenna-on-Package (AoP) module. The M905 is a fully integrated, ultra low power Bluetooth LE module designed to enable a wide range of sophisticated wirelessly-connected products with a ‘plug-and-play’ solution that can lower development costs and speed time-to-market.
The module employs the 3 by 3.2mm wafer-level chip scale package (WL-CSP) variant of Nordic’s nRF52832 SoC, which alongside MtM’s System-in-Package (SiP) technology results in a 6.5 by 6.5mm form factor and makes the module suitable for a wide range of space-constrained, low power applications, for example wearables or standalone devices offering voice control, pattern recognition, or environmental learning functionality.
The M905 allows product manufacturers to speed up development, production, and time-to-market of demanding Bluetooth 4.2-enabled applications, without the customer requiring any RF design expertise. The module includes an integrated antenna, along with a full range of programmable on-chip analog and digital peripherals.
Nordic’s nRF52832 Bluetooth LE SoC, a member of Nordic’s sixth generation of ultra low power (ULP) wireless connectivity solutions enables the module to power even the most complex, processor-intensive wireless applications.