The nRF24L01 is a highly integrated, ultra low power (ULP) 2Mbps RF transceiver IC for the 2.4GHz ISM (Industrial, Scientific and Medical) band. With peak RX/TX currents lower than 14mA, a sub μA power down mode, advanced power management, and a 1.9 to 3.6V supply range, the nRF24L01 provides a true ULP solution enabling months to years of battery lifetime when running on coin cells or AA/AAA batteries. The Enhanced ShockBurst™ hardware protocol accelerator additionally offloads time critical protocol functions from the application microcontroller enabling the implementation of advanced and robust wireless connectivity with low cost 3rd-party microcontrollers.
The nRF24L01 integrates a complete 2.4GHz RF transceiver, RF synthesizer, and baseband logic including the Enhanced ShockBurst™ hardware protocol accelerator supporting a high-speed SPI interface for the application controller. No external loop filter, resonators, or VCO varactor diodes are required, only a low cost ±60ppm crystal, matching circuitry, and antenna.
The Nordic nRF24L01 is available in a compact 20-pin 4 x 4mm QFN package.
The Nordic nRF24L01 is a highly integrated, ultra low power (ULP) 2Mbps RF transceiver IC for 2.4GHz ISM band operation.
Temperature range of -40 to +80 ºC
|nRF24L01 Product Specification||2.0|
|Product Change Notification|
|Product Change Notification - Cu as additional bond wire option||1.0|
|Product Change Notification||1_0|
|Software examples using ShockBurst modes in nRF24L01 and nRF24LU1||2.1|
|QFN Soldering Reflow Guidelines||1.2|
|Benefits of Total Integration of Large RF Circuits|
|Introduction to wireless networks|
|nRF Performance Test Guidelines||1.0|
|Quarterwave printed monopole antenna for 2.4GHz|
|Regulatory and Compliance Standards for RF Devices|
|Sharing crystal with a microcontroller (MCU)||1.1|
|Tuning the nRF24xx matching network|
|Crystal Oscillator Design Considerations|
|nRF24L01 Hazardous Substance Report, manufactured in ATP using Cu bond wire||2014_02|
|nRF24L01 Material Composition Report, manufactured in ATP using Cu wire bond and CRM1085 DA Material||2013_04|
|nRF24L01 Material Composition Report, manufactured in ATP using Cu wire bond and AMK-06 DA Material||2013_08|